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Advanced Substrate Technologies, a Broadcom and TOPPAN joint venture, opened a 95,000 sq m FC-BGA substrate plant in Singapore, easing a part the industry is short of.
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AST's new Singapore plant, in a photo TOPPAN published with its release on the facility. Image shows the building, not the opening ceremony.
Image: TOPPAN
Source · Press image from the TOPPAN newsroom, used for news reporting.
Advanced Substrate Technologies (AST), a joint venture of Broadcom and TOPPAN Holdings, officially opened its Singapore plant on 29 September 2026, according to Little Big Red Dot, which reported the opening on 30 September citing Broadcom. The site at 9 Pesawat Drive in Jurong Lake District is described as Singapore's first high-end Flip Chip Ball Grid Array (FC-BGA) substrate facility and TOPPAN's first FC-BGA plant outside Japan.
AST says it has hired more than 300 people and will create more than 330 jobs as volume production starts, though the report does not say how the figures relate.
Illustration (AI-generated)
FC-BGA substrates connect AI, networking and high-performance computing chips to circuit boards, and the report says they are in short supply worldwide. The plant covers 95,000 square metres. Broadcom is both a partner in the venture and the primary customer for the substrates.
AST has already hired more than 300 staff in Singapore, including engineers and technicians, and says it will create more than 330 jobs as high-volume manufacturing begins later in 2026. It also plans to carry out research and development in the country. Charlie Kawwas, president of Broadcom's semiconductor solutions group, said the Singapore capacity gives Broadcom flexibility while the industry remains short of advanced substrates. AST chief executive Yoshiyuki Iida said the investment reflects a long-term commitment to Singapore as a manufacturing hub and to supply-chain resilience. Deputy Prime Minister Gan Kim Yong attended the opening.
For AI hardware, the substrate is one of the packaging inputs that can limit how many accelerators and switch chips ship, regardless of how much wafer capacity exists. A second source of large-body, high-layer-count substrates outside Japan adds supply for Broadcom's custom accelerator and networking silicon, and the power-hungry AI clusters that use them.
Several points are not stated in the report: the total investment, the plant's production capacity or output volumes, the exact start date of high-volume manufacturing beyond "later in 2026", the timing and scope of a later expansion phase, and each partner's equity stake in AST. The report also does not say how the 300-plus hires relate to the 330-plus jobs figure.
